ROTATABLE SPUTTERING TARGETS
ROTATABLE SPUTTERING TARGETS
Rotatable Sputtering Targets
RETI specializes in the design and production of rotatable sputtering targets that include a variety of metals and alloys compatibly selected to meet the unique requirements of our clients.
We recognize that each project comes with its own set of challenges and specifications. RETI’s team of experienced engineers works closely with clients to provide tailor-made options that covering raw material melting process, deformation technique, composition and degas control, grain size, and other performance characteristics that be concerned.
Advantage of rotatable targets
- Enhance uniformity in film deposition. This is crucial for applications requiring precise thickness and composition control.
- Distribute the erosion over a larger surface area, reducing localized wear and extending the overall lifetime of the target material. This characteristic is essential for cost-effective and efficient deposition processes.
- Improve target utilization, reduce downtime and increase operational efficiency.
- Result in more consistent deposition across the entire substrate, minimize edge-related issues such as step coverage variations.
- Improve film quality, with reduced defects and enhanced adherence to the substrate.
Rotatable Targets Produced by Vacuum Melting and Extruding
Titanium
Purity: 99.5%~99.995%
Melting: VAR
Forming: Extruding
Configuration: Monolithic
Bonding: None
Tantalum
Purity: 99.95%, 99.99%
Melting: EBM
Forming: Extruding
Configuration: Monolithic
Bonding: Optional
Niobium-Zirconium (Nb-Zr)
Purity: NbZr1 wt%, NbZr10 wt%
Melting: EBM
Forming: Extruding
Configuration: Monolithic
Bonding: Optional
Zirconium
Purity: 99.2%(Zr<2.5%), 99.95% (Zr<0.2%)
Melting: VAR
Forming: Extruding
Configuration: Monolithic
Bonding: None
Vanadium
Purity: 99.9%
Melting: EBM
Forming: Extruding
Configuration: Monolithic, Multiple sections
Bonding: Optional
Copper
Purity: 99.95%~99.9995%
Melting: VIM
Forming: Extruding
Configuration: Monolithic
Bonding: None
Niobium
Purity: 99.95%
Melting: EBM
Forming: Extruding
Configuration: Monolithic
Bonding: Optional
Nickel-Vanadium (Ni-V)
Ratio: 93Ni:7V wt%
Melting: VIM
Forming: Extruding
Configuration: Monolithic, Multiple sections
Bonding: Optional
Aluminum
Purity: 99.95%~99.9995%
Melting: VIM
Forming: Extruding
Configuration: Monolithic
Bonding: None
Rotatable Targets Produced by Powder Pressing
Chromium
Purity: 99.7%, 99.9%, 99.95%
Process: HIP
Relative density: 90%
Configuration: Monolithic, Multiple sections
Molybdenum
Purity: 99.95%, 99.97%
Process: CIP+HIP+Sintering
Relative density: 95% min.
Configuration: Monolithic, Multiple sections
Tungsten
Purity: 99.95%
Process: CIP+HIP+Sintering
Relative density: 90%
Configuration: Monolithic, Multiple sections